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StencilMate(TM) Brochure
The StencilMate™ sales literature is designed for users to get more information on the product, see a demonstration on the use of the major steps of the product as well as providing , along with the data sheets and other support literature the technical specifications for determining the product and process specifications using these “bumping” stencils.
The sales literature pictorially depicts the major steps of the StencilMate™ based QFN rework process for leadless devices. It includes the processes of device preparation, attachment of the stencil, solder paste printing on to th package, reflow, clean up inspection and placement of the “bumped” device.
The sales sheet enumerates, along with support of the product data sheets the most important specifications of the product and process. This allows you to specify the bumping process if you are outsourcing the work or doing the work internally and need to send more information on you your end user. We also point you to the IPC 7711 rework process steps which outline the process in great detail.