Nicely Done
This greatly simplified putting balls onto a removed BGA
BEST soldering geeks enable electronics companies to be more effective through professional PCB rework/repair, assembly and training tools
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This is a unique BGA reballing preform for pitches greater than 0.4mm for new parts where you have a mechanical part specification which can be uploaded.
EZReball(TM) improves first pass yields and makes the reballing of devices fast and simple.
This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.
BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305) high temp
This is for those who desire and EZReball(TM) for a specific pattern that will be uploaded as part of an order.
We will send you a checkplot/drawing after receipt of order and acceptance for your approval.
EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.
Standard lead time is (3) business days for 2 packs. NOTE: There is no need for alignment fixtures as the patterns square up to the package dimensions for alignment.
This greatly simplified putting balls onto a removed BGA
Nice product