EZReball(TM) New Pattern

EZReball(TM) New Pattern Pitch Greater Than 0.4mm
0.50 LBS
Calculated at Checkout
Maximum file size is: 0KB
Current stock: 0


This is a unique BGA reballing preform for pitches greater than 0.4mm for new parts where you have a mechanical part specification which can be uploaded.

EZReball(TM)  improves first pass yields and makes the reballing of devices fast and simple.

This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.

BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305) high temp 

  • Minimum Aperture Size: .002in (.05mm)
  • Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
  • Minimum Pitch: 1.50-0.50mm pitch
  • Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

This is for those  who desire and EZReball(TM) for a specific pattern that will be uploaded as part of an order.

We will send you a checkplot/drawing after receipt of order and acceptance for your approval.

EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.

Standard lead time is (3) business days for 2 packs. NOTE: There is no need for alignment fixtures as the patterns square up to the package dimensions for alignment.


Reviews (4)

Jason F 14th Dec 2021

Nicely Done

This greatly simplified putting balls onto a removed BGA

Luan C 16th Jun 2021

Fast way to re-attach solder spheres

Nice product


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