Fast way to re-attach solder spheres
This is a unique BGA reballing preform for pitches greater than 0.4mm for new parts where you have a mechanical part specification which can be uploaded.
EZReball(TM) improves first pass yields and makes the reballing of devices fast and simple.
This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.
BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305) high temp
This is for those who desire and EZReball(TM) for a specific pattern that will be uloaded as part of an order.
We will send you a checkplot/drawing after receipt of order and acceptance for your approval.
EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.
Standard lead time is (3) business days for 2 packs.
After looking at the video this was easy to use