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Rework Stencil - StencilQuik

$86.00
(20 reviews) Write a Review
SKU:
StencilQuik(TM) BGA Rework Stencil
Weight:
0.50 LBS
Shipping:
Calculated at Checkout

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This is a unique stenciling BGA rework stencil system. It improves first pass yields and repairs solder mask that may have been damaged during device .

This configurable part number means you do not have to sort through all of the patterns listed (there are many more).

The data you send us to make your BGA stencil must have:

         # of solder balls

         Pattern of the solder array incl dimensions

         Overall package size

         Ball size (we will choose the right thickness)

This BGA rework stencil come in (3) thicknesses-0.004", 0.006" and 0.008" thick.

More information on the testing of this device can be found here.

  • Minimum Aperture Size: .002in (.05mm)
  • BGA Rework Stencil Material: Kapton(TM) like high temp resistant film with release liner. Adhesive is a high temperature high tack type of adhesive.
  • Minimum Pitch: .0078 in (0.20mm)
  • Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

We accept either standard GERBER files, part data sheets or CAD files in order to design and fabricate your BGA stencil.

StencilQuik(TM) stencils are packaged in groups of (10) in a small anti-static bag.

Standard lead time is shipping within 5 business days. 24-48 hours after file approval and up to 2 packs is available (choose option when ordering). All stencils are made to order.

20 Reviews Hide Reviews Show Reviews

  • 5
    Good Product Saves Time

    Posted by Tanya R on 19th Jun 2017

    When I have a board with "iffy" mask these little guys help place the RAM chip while repairing the mask.

  • 5
    Miracle Product

    Posted by George T on 7th Jun 2017

    Repaired damaged mask underneath the BGA. Wow!

  • 5
    Miracle Product

    Posted by George T on 7th Jun 2017

    Repaired damaged mask underneath the BGA. Wow!

  • 5
    Warped package lifesaver

    Posted by JR riddle on 7th Feb 2017

    Had a very thin 0.5mm 20 x 20mm package which warped like cray. Lots of shorts using other techniques. Put the 4 mil down using solder paste and solved the problem!

  • 5
    Saved our rework project

    Posted by Alexander G on 19th Dec 2016

    Had some very thin parts that were warped during LF profile. Needed to place these down , dial temp back using solder paste to print and it worked!

  • 5
    Great product!

    Posted by Joe R on 18th Nov 2015

    Was able to place BGAs with 0.5mm pitch with this device, some paste flux and a heat gun! I did 4 in a row.

  • 4
    Great Product for Mask Repair

    Posted by George T on 4th Apr 2015

    I was skeptical about being a fix for mask damage. The product proved me wrong. It worked like a champ. Only wish we could have gotten in 1 or 2 days instead of 6-7.

  • 4
    Got it fast and correct

    Posted by Fred T on 6th Aug 2014

    Liked that fact that I could discuss what I needed with a real live person!

  • 4
    Nice simple product

    Posted by Borke T on 31st Dec 2013

    These are great for getting a BGA down with only a heat gun and some magnification for stencil alignment

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