This is a unique stenciling BGA rework stencil system. It improves first pass yields and repairs solder mask that may have been damaged during device .
This configurable part number means you do not have to sort through all of the patterns listed (there are many more).
The data you send us to make your part must have:
# of solder balls
Pattern of the solder array incl dimensions
Overall package size
Ball size (we will choose the right thickness)
This BGA rework stencil come in (3) thicknesses-0.004", 0.006" and 0.008" thick.
More information on the testing of this device can be found here.
- Minimum Aperture Size: .002in (.05mm)
- BGA Rework Stencil Material: Kapton(TM) like high temp resistant film with release liner. Adhesive is a high temperature high tack type of adhesive.
- Minimum Pitch: .0078 in (0.20mm)
- Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)
We accept either standard GERBER files, part data sheets or CAD files.
StencilQuik(TM) stencils are packaged in groups of (10) in a small anti-static bag.