BGA Rework Stencil-Configurable

$77.00
(15 reviews) Write a Review
SKU:
StencilQuik(TM) BGA Rework Stencil
Weight:
0.50 LBS
Shipping:
Calculated at Checkout
BGA stay in place stencil

This is a unique stenciling BGA rework stencil system. It improves first pass yields and repairs solder mask that may have been damaged during device .

This configurable part number means you do not have to sort through all of the patterns listed (there are many more).

The data you send us to make your part must have:

         # of solder balls

         Pattern of the solder array incl dimensions

         Overall package size

         Ball size (we will choose the right thickness)

This BGA rework stencil come in (3) thicknesses-0.004", 0.006" and 0.008" thick.

More information on the testing of this device can be found here.

  • Minimum Aperture Size: .002in (.05mm)
  • BGA Rework Stencil Material: Kapton(TM) like high temp resistant film with release liner. Adhesive is a high temperature high tack type of adhesive.
  • Minimum Pitch: .0078 in (0.20mm)
  • Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

We accept either standard GERBER files, part data sheets or CAD files.

StencilQuik(TM) stencils are packaged in groups of (10) in a small anti-static bag.

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15 Reviews Hide Reviews Show Reviews

  • 5
    Nice Product

    Posted by Ricardo H on 26th Oct 2017

    Very nice and easy for BGA prototyping

  • 5
    Simple but Effective

    Posted by Boris G on 23rd Oct 2017

    Very good for repairing of solder mask

  • 4
    Nice little product

    Posted by Betsy B on 17th Oct 2017

    Repaired the mask that came off with the device

  • 5
    Saves time

    Posted by Tanjin G on 23rd Jun 2017

    This made placing BGAs on a few prototype boards easy. Thanks!

  • 5
    Good Product Saves Time

    Posted by Tanya R on 19th Jun 2017

    When I have a board with "iffy" mask these little guys help place the RAM chip while repairing the mask.

  • 5
    Miracle Product

    Posted by George T on 7th Jun 2017

    Repaired damaged mask underneath the BGA. Wow!

  • 5
    Miracle Product

    Posted by George T on 7th Jun 2017

    Repaired damaged mask underneath the BGA. Wow!

  • 5
    Warped package lifesaver

    Posted by JR riddle on 7th Feb 2017

    Had a very thin 0.5mm 20 x 20mm package which warped like cray. Lots of shorts using other techniques. Put the 4 mil down using solder paste and solved the problem!

  • 5
    Saved our rework project

    Posted by Alexander G on 19th Dec 2016

    Had some very thin parts that were warped during LF profile. Needed to place these down , dial temp back using solder paste to print and it worked!