This is a unique stenciling BGA rework stencil system. It improves first pass yields and repairs solder mask that may have been damaged during device .
This configurable part number means you do not have to sort through all of the patterns listed (there are many more).
The data you sned us to make your part must have:
# of solder balls
Pattern of the solder array incl dimensions
Overall package size
Ball size (we will choose the right thickness)
This BGA rework stencil come in (3) thicknesses-0.004", 0.006" and 0.008" thick.
More information on the testing of this device can be found here.
We accept either standard GERBER files, part data sheets or CAD files.
StencilQuik(TM) stencils are packaged in groups of (10) in a small antistatic bag.
Posted by JR riddle on 7th Feb 2017
Had a very thin 0.5mm 20 x 20mm package which warped like cray. Lots of shorts using other techniques. Put the 4 mil down using solder paste and solved the problem!
Posted by Alexander G on 19th Dec 2016
Had some very thin parts that were warped during LF profile. Needed to place these down , dial temp back using solder paste to print and it worked!
Posted by Joe R on 18th Nov 2015
Was able to place BGAs with 0.5mm pitch with this device, some paste flux and a heat gun! I did 4 in a row.
Posted by George T on 4th Apr 2015
I was skeptical about being a fix for mask damage. The product proved me wrong. It worked like a champ. Only wish we could have gotten in 1 or 2 days instead of 6-7.
Posted by Fred T on 6th Aug 2014
Liked that fact that I could discuss what I needed with a real live person!
Posted by Borke T on 31st Dec 2013
These are great for getting a BGA down with only a heat gun and some magnification for stencil alignment
Posted by Jonah on 15th Nov 2013
the mask got pulled off with my BGA. It would have taken several days to touch up all of the ask as I had 6 boards all with the same problem. these little beauties were band aids and repaired the mask!
Posted by Johnny Q on 21st Sep 2013
This took some getting used to but I aligned, placed and squeegeed solder paste in to the apertures. The BGA after being placed was reflowed using a hot air source. Vola!