This is a unique stenciling BGA rework stencil system. It improves first pass yields and repairs solder mask that may have been damaged during device .

This configurable part number means you do not have to sort through all of the patterns listed (there are many more).

The data you send us to make your BGA stencil must have:

         # of solder balls

         Pattern of the solder array incl dimensions

         Overall package size

         Ball size (we will choose the right thickness)

This BGA rework stencil come in (3) thicknesses-0.004", 0.006" and 0.008" thick.

More information on the testing of this device can be found here.

• Minimum Aperture Size: .002in (.05mm)

• BGA Rework Stencil Material: Kapton(TM) like high temp resistant film with release liner. Adhesive is a high temperature high tack type of adhesive.

• Minimum Pitch: .0078 in (0.20mm)

• Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

We accept either standard GERBER files, part data sheets or CAD files in order to design and fabricate your BGA stencil.

StencilQuik(TM) stencils are packaged in groups of (10) in a small anti-static bag.

Standard lead time is shipping within 5 business days. 24-48 hours after file approval and up to 2 packs is available (choose option when ordering). All stencils are made to order.