The IPC-A-600, "Acceptability of Printed Boards " standard is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms of PCB workmanship quality. It includes...

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a...

This is a unique stenciling BTC (QFN , LGS, etc) rework stencil system. It improves first pass yields and allows you to rework leadless devices without high-end rework systems. This configurable part number means you do not have to sort through all of...

This is a unique stenciling BGA rework stencil system. It improves first pass yields and repairs solder mask that may have been damaged during device . This configurable part number means you do not have to sort through all of the patterns listed (there...

Circuit Frame for SMT Pad Repair-Dry Film Method   It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond...

Circuit Frame for Trace Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the...

Circuit Frame for Trace Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the...

Circuit Frame for Throughhole Pad Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond...

Circuit Frame for SMT Pad Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to...

Circuit Frame for SMT Pad Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to...

Circuit Frame for SMT Pad Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to...

Circuit Frame for BGA Pads-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB...

Circuit Frame for BGA Pads-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB...

Circuit Frame for BGA Pads-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB...

Circuit Frame for Throughole Pads-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to...

Circuit Frame for Throughole Pads-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to...

Circuit Frame for Traces-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB...

Circuit Frame for Edge Connectors-Dry Film Method Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating.The...