Gold circuit Frame for Contact Finger Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond...

Gold Circuit Frame for Pads -Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is a nickel / gold. It has a 6 month minimum shelf life and is date-coded on the...

Circuit Frame for Contact Finger Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond...

Circuit Frame for Pads -Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and is...

Circuit Frame for Pad Repair-Epoxy Method  It has a 6 month minimum shelf life and is date-coded on the circuit frame. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side...

Circuit Frame for Pad Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the...

The EZReball(TM) Frames are designed to be aligned and "squared up" to the package being reballed by the precision cutting of the reballing preform. There are cases where these frames will help to align the (2) parts more easily without impact the...

There are times when semiconductor packages warp or they have so little mass compared to the EZRebal(TM) preform that they need to have extra force "pushing down" on the device. This custom made weight will be placed on top of the device and allow for...

PCB Squeegee These can be used to roll solder paste through the stencil aperatures for prototype printing. One set custom made for stencil size.

PCB Board Holders These can be used to align the PCB to the stencil for prototype printing. One set consisting of (2) pieces.

This kit is designed for training purposes and for certification/re-certification of IPC-7711 operators or instructors. This kit is intended for IPC 7711/21 Revision "C" certification and re-certification testing. It is ideal for use in these classes...

BEST HotDots™ are a versatile, clean and effective method of attaching jumper wires and other elements of a PCB in place during the assembly process. HotDots™ are designed to “take the heat” as they are made from a polymide film...

BEST HotDots™ are a versatile, clean and effective method of attaching jumper wires and other elements of a PCB in place during the assembly process. HotDots™ are designed to “take the heat” as they are made from a polyimide film...

BEST HotDots™ are a versatile, clean and effective method of attaching jumper wires and other elements of a PCB in place during the assembly process. HotDots™ are designed to “take the heat” as they are made from a polymide film...

BEST HotDots™ are a versatile, clean and effective method of attaching jumper wires and other elements of a PCB in place during the assembly process. HotDots™ are designed to “take the heat” as they are made from a polyimide film...

The BEST Pad Repair kit dry film version includes the tools and materials needed to reliably replace lifted or damaged surface mount and BGA pads on PCB's. This kit includes 3 different tin plated copper base material circuit frame patterns, which offer...

IPC 6012D Qualification and Performance Specification for Rigid Printed Boards This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without...

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a...