Circuit Frame for Edge Connector-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and...

Circuit Frame for Edge Connector-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and...

Circuit Frame for SMT Pads-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and is...

Circuit Frame for Pads-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and is...

Circuit Frame for Lands-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and is...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is lead free. Ball Size: 0.76mm Ball Count: 292 Ball Pattern: 27x27...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices.The quantity is 15 per bag. Stencil Thickness:0.015 Aperture Size:.76mm Ball...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is lead free. Ball Size: 0.76mm Ball Count: 292 Ball Pattern: 21x21...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices.The quantity is 15 per bag. Stencil Thickness:0.015 Aperture Size:.76mm Ball...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is lead free. Ball Size: 0.76mm Ball Count: 272 Ball Pattern: 27x27...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices.The quantity is 15 per bag. Stencil Thickness:0.015 Aperture Size:.76mm Ball...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is lead free. Ball Size: 0.76mm Ball Count: 256 Ball Pattern: 27x27...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices.The quantity is 15 per bag. Stencil Thickness:0.015 Aperture Size:.76mm Ball...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is lead free. Ball Size: 0.76mm Ball Count: 256 Ball Pattern: 17x17...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices.The quantity is 15 per bag. Stencil Thickness:0.015 Aperture Size:.76mm Ball...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is lead free. Ball Size: 0.76mm Ball Count: 1089 Ball Pattern: 42x42...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices.The quantity is 15 per bag. Stencil Thickness:0.015 Aperture Size:.76mm Ball...

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is lead free. Ball Size: 0.76 mm Ball Count: 1024 Ball Pattern: 42x42...