This is a unique stenciling BTC (QFN , LGS, etc) rework stencil system. It improves first pass yields and allows you to rework leadless devices without high-end rework systems. This configurable part number means you do not have to sort through all of...

This is a unique stenciling BGA rework stencil system. It improves first pass yields and repairs solder mask that may have been damaged during device . This configurable part number means you do not have to sort through all of the patterns listed (there...

Circuit Frame for SMT Pad Repair-Dry Film Method   It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond...

Circuit Frame for Trace Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the...

Circuit Frame for Trace Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the...

Circuit Frame for Throughhole Pad Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond...

Circuit Frame for SMT Pad Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to...

Circuit Frame for SMT Pad Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to...

Circuit Frame for SMT Pad Repair-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to...

Circuit Frame for BGA Pads-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB...

Circuit Frame for BGA Pads-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB...

Circuit Frame for BGA Pads-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB...

Circuit Frame for Throughole Pads-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to...

Circuit Frame for Throughole Pads-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to...

Circuit Frame for Traces-Dry Film Method It has a 6 month minimum shelf life and is date-coded on the circuit frame.Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB...

Circuit Frame for Edge Connectors-Dry Film Method Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating.The...

Circuit Frame for Edge Connectors-Dry Film Method Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating.The...

Circuit Frame for SMT Pads-Dry Film Method Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating.The...