EZReball(TM) New Pattern Pitch LESS Than 0.4mm

EZReball(TM) New Pattern Pitch LESS Than 0.4mm
0.50 LBS
$0.00 (Fixed Shipping Cost)
Current stock: 0


This is a unique BGA reballing preform for pitches less than 0.4mm for new parts where you have a mechanical part specification which can be uploaded.

EZReball(TM)  improves first pass yields and makes the reballing of devices fast and simple.

This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.

BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305) high temp 

  • Minimum Aperture Size: .002in (.05mm)
  • Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
  • Minimum Pitch: 1.50-0.50mm pitch
  • Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

This is for those  who desire and EZReball(TM) for a specific pattern that will be uloaded as part of an order.

We will send you a checkplot/drawing after receipt of order and acceptance for your approval.

EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.

Standard lead time is (3) business days for 2 packs. NOTE: There is no need for alignment fixtures as the patterns square up to the package dimensions for alignment.


Reviews (7)

Svenn G 7th Nov 2022

Way easier than metal stencils

This is the first time I tried something like this. I usually pour balls into a metal form stencil. This was a pretty challenging pattern and size. The EZ product made it very easy to reball.

Esplando W 18th Apr 2022

Nice product

These preforms were easy to use. Thanks for getting them out so soon!


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