EZReball(TM) New Pattern Pitch LESS Than 0.4mm

EZReball(TM) New Pattern Pitch LESS Than 0.4mm
0.50 LBS
$0.00 (Fixed Shipping Cost)
Current stock: 0


This is a unique BGA reballing preform for pitches less than 0.4mm for new parts where you have a mechanical part specification which can be uploaded.

EZReball(TM)  improves first pass yields and makes the reballing of devices fast and simple.

This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.

BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305) high temp 

  • Minimum Aperture Size: .002in (.05mm)
  • Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
  • Minimum Pitch: 1.50-0.50mm pitch
  • Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

This is for those  who desire and EZReball(TM) for a specific pattern that will be uloaded as part of an order.

We will send you a checkplot/drawing after receipt of order and acceptance for your approval.

EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.

Standard lead time is (3) business days for 2 packs.


Reviews (4)

Esparonzo W 15th Apr 2021

Nice product

The item shipped in the time I thought it would. Easy to use as long as you have dexterity.

Jessica W 12th Nov 2020

Great Way to Reball Components

Tried this product and it was pretty easy following the video instructions.


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