StencilQuik™ BGA Stencils
The StencilQuik™ sales literature is designed for users to get more information on the product, see a demonstration on the use of the major steps of the product as well as providing , along with the data sheets and other support literature the technical specifications for determining the product and process specifications using these BGA rework stencils.
The sales literature pictorially depicts the major steps of the StencilQuik™ based rework process for BGAs, CSPs and other leaded devices. It includes the processes of device preparation, alignment and activation of the stencil adhesive, solder paste or paste flux printing on to the board, reflow, clean up inspection and placement of the reworked device.
The sales sheet enumerates, along with support of the product data sheets the most important specifications of the product and process. This allows you to specify the BGA rework process if you are outsourcing the work or doing the work internally and need to send more information on you your end user. We also point you to the IPC 7711 rework process steps which outline this particular BGA rework process in great detail.