BGA Reball Preform
This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is lead free.
- Ball Size: 0.76 mm
- Ball Count: 1024
- Ball Pattern: 42x42 mm
- Pitch: 1.27 mm
The quantity is 15 per bag.
