Circuit Frame for Edge Connectors-Dry Film Method Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating.The...

Circuit Frame for SMT Pads-Dry Film Method Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating.The...

Circuit Frame for Pads-Dry Film Method Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating.The backing...

Circuit Frame for Lands-Dry Film Method Tin plated with dry film attached. The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating.The backing...

Circuit Frame for SMT Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and...

Circuit Frame for Trace Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and is...

Circuit Frame for Trace Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and is...

Circuit Frame for Throughhole Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf...

Circuit Frame for Throughhole Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf...

Circuit Frame for Throughhole Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf...

Circuit Frame for SMT Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and...

Circuit Frame for SMT Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and...

Circuit Frame for SMT Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and...

Circuit Frame for BGA Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and...

Circuit Frame for BGA Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and...

Circuit Frame for BGA Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf life and...

Circuit Frame for Throughole Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf...

Circuit Frame for Throughole Pad Repair-Epoxy Method The base metal is 1 oz copper with chemical etchant which results in a high bond strength to the PCB. The coating on the PCB side is an immersion bright tin coating. It has a 6 month minimum shelf...