There are times when semiconductor packages warp or they have so little mass compare to the EZRebal(TM) preform that they need to have extra force "pushing down" on the device. This custom made weight will be placed on top of the device and allow for there to be intimate contact between the balls of the preform and the pads on the device.
One custom weight included. Please specify package size or specify your EZReball(TM) preform so we can send you the correct weight.
Custom made based on package size inside of 3-5 days.